• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    New methods of transient bonding and articles formed from these methods are provided. The methods include bonding a package wafer (12) to a carrier wafer or substrate (32) only at its outer periphery to help protect the package wafer (12) and package locations during subsequent processing and handling. The boundary bonds (46) formed by this process are chemically and thermally resistant, but can also be softened, dissolved, or mechanically broken to allow the wafers (12, 32) to be lightly fired by or at very low forces close to room temperature during the manufacturing process.
    公开号:AT12755U1
    申请号:TGM514/2010U
    申请日:2009-01-23
    公开日:2012-11-15
    发明作者:
    申请人:Brewer Science Inc；
    IPC主号:
    专利说明:

    Austrian Patent Office AT12 755U1 2012-11-15
    description
    FIELD OF THE INVENTION
    The present invention broadly relates to new methods for temporarily bonding wafers that can hold a package wafer on a carrier substrate during thinning and other back side processing operations.
    DESCRIPTION OF THE PRIOR ART
    Integrated circuits, power semiconductors, photonic circuits, microelectromechanical systems (MEMS), embedded passive arrays, packaging interposers, and a host of other silicon and compound semiconductor based microcomponents are combined into arrays on wafer substrates ranging in diameter from 1 to 12 Inch (2.54 cm to 30.48 cm) produced. The devices are then separated into individual devices or dies which are transformed into a package to allow practical interfacing with the macroscopic environment, for example, by connecting to a circuit board. It has become increasingly popular to construct the package package on or around the die as long as it still belongs to the wafer array. This practice, called wafer-level packaging, reduces overall packaging costs and allows for higher interconnect density to be achieved between the device and its microelectronic environment than is possible with other conventional packaging technologies, which typically have exterior dimensions several times larger than in the present module.
    Until recently, circuit diagrams have generally been limited to two dimensions, that is, the electrical connections between the package and the corresponding package or packaging surface to which it is mounted have generally been arranged in a horizontal or x-y plane. The microelectronic industry has now recognized that a significant increase in device junction density and corresponding reductions in signal delay (as a result of shortening the distance between electrical connection points) is achieved by stacking and interconnecting devices in the vertical direction, ie in the z-direction can be. The common requirements for stacking are as follows: (1) thinning of the package from the backside in the direction through the wafer, and subsequent formation of electrical connections through the wafer, commonly 'thru-silicon vias' or TSVs that end up on the back of the device. For this reason, thinning out of a semiconductor package has now become a standard practice, even though the packages are not packaged in a stacked configuration because it facilitates heat dissipation and can achieve a much smaller form factor in compact electronic products such as cell phones.
    There is an increasing interest in thinning out semiconductor devices down to less than 100 microns in order to reduce their profiles, especially when stacked or the corresponding packages in which they are located, and to the formation of electrical connections on the Back of the blocks simplify. Silicon wafers that are used in large scale in the production of integrated circuits typically have a diameter of 200 to 300 mm and a thickness in the direction through the wafer of approximately 750 microns. Without thinning out, it would be almost impossible to form electrical contacts on the back side which would connect to the circuits on the front side where the connections are made through the wafer. High-efficiency thinning processes for semiconductor grade and compound semiconductor silicon based on mechanical grinding (backside grinding) and polishing as well as chemical etching are now in commercial use. These processes allow a device wafer thickness that can be reduced to less than 100 microns in a few minutes while maintaining uniform thickness control across the wafer.
    Component wafers that have been thinned to less than 100 microns, and especially those that have been thinned to 60 microns, are particularly sensitive and must be supported over their entire dimensions to prevent cracking and breakage. Numerous wafer walls and wafer chucks have been developed for the transfer of ultra-thin device wafers, but the problem still remains of how to hold the wafers during backside abrasion and TSV formation processes, such as chemical mechanical polishing (CMP). which include lithography, etching, deposition, annealing, and cleaning, as these steps exert high thermal and mechanical stresses on the component as it is thinned or thinned out. An increasingly popular approach to handling ultra-thin wafers involves mounting the full-thickness brick wafers side-down on a rigid support with a polymer adhesive. The said wafer is then thinned from the back and processed. The fully processed ultra-thin wafer is then removed or debonded from the carrier by thermal, thermomechanical or chemical processes after the backside processing has been completed.
    Common substrates include silicon (for example, a masterbatch wafer), soda lime glass, borosilicate glass, sapphire, and various metals and ceramics. The carriers can be square or rectangular, but are more usually round and sized to mate with the device wafer so that the bonded device can be handled in conventional processing tools and cassettes. Sometimes the carriers are perforated to accelerate the debonding process when a liquid chemical agent is used as a release agent to dissolve or disintegrate the polymer adhesive.
    The polymer adhesives used for temporary wafer bonding are typically applied from solutions by spin coating or spray coating, or laminated as dry film tapes. The adhesives applied by spin coating and spray coating are becoming increasingly preferred because they form coatings having a higher thickness regularity than can be provided by belts. The higher thickness uniformity translates to greater control over the thickness uniformity across the wafer after thinning. The polymer adhesives show a high bond strength to the device wafer and the carrier.
    The polymer adhesive may be applied to the package wafer, the carrier, or both by means of a spin coating, depending on the thickness and coating flatness (flatness) required. The coated shepherd is tempered to remove all of the coating agent from the polymeric adhesive layer. The coated wafer and carrier are then placed in a heated mechanical press for bonding. Sufficient temperature and pressure are applied to cause the adhesive to flow into and fill the structural elements of the package wafer and to achieve intimate contact with all areas of the surfaces of the package wafer and the carrier.
    The debonding of a package wafer from the substrate after backside processing is typically carried out in one of the following four ways: 1. Chemically, the bonded wafer stack is turned into a solvent or a chemical
    Dipped or sprayed with agent to dissolve or decompose the polymer adhesive.
    2. Photo decomposition: the bonded wafer stack is irradiated with a light source through a transparent support with the aim to decompose the adhesive boundary layer adjacent to the support by means of the light (photodecomposition). The carrier may then be separated from the stack and the remainder of the polymer adhesive is peeled off the package wafer while holding said wafer on a chuck.
    3. Thermomechanical: the bonded wafer stack is heated above the softening temperature of the polymer adhesive, and the package wafer is then pushed or pulled away from the carrier while being held by a full wafer holding chuck.
    4. Thermal decomposition: the bonded wafer stack is heated above the decomposition temperature of the polymer adhesive, causing the said adhesive to volatilize and lose adhesion to the package wafer and the carrier.
    Each of the debonding processes has disadvantages that severely limit their use in a production environment. Chemical debonding by dissolving the polymer adhesive, for example, is a slow process because the solvent must be spread over long distances through the viscous polymer medium to cause delamination. That is, the solvent must be distributed from the edge of the bonded substrate or distributed from a perforation in the carrier to the local area of the adhesive. In either case, the minimum distance required for diffusion and solvent penetration is at least three to five millimeters, and said removal can be much greater, even with perforations that serve to increase solvent contact with the adhesive layer. Treatment times of a few hours even at high temperatures (greater than 60 ° C) are usually required for debarking and the average wafer output will be low.
    Photo-decomposition is also a slow process because not all of the bonded substrate can be exposed simultaneously. Instead, the exposing light source, which is normally a laser having a beam cross-section of only a few millimeters, must be simultaneously focused to a small area to provide enough energy to decompose the adhesive bondline. The beam scans (or scans) the substrate in the transverse direction as standard to debond the entire surface, resulting in long decarburization times.
    Although thermo-mechanical (TM) debarking can typically be accomplished in a few minutes, it does have other limitations that can reduce the device discharge rate. Backside processes for temporarily bonded package wafers often require operating temperatures higher than 200 ° C or even 300 ° C. The polymer adhesives used for TM debonding must not decompose or soften excessively at or near the working temperature, otherwise debonding will occur prematurely. As a result, the adhesives are usually designed so that they are sufficiently softened sufficiently at 20 to 50 ° C above the working temperature for the debinding to be achieved. The high temperature required for debonding exerts heavy loads on the bonded pair due to thermal expansion. At the same time, the heavy mechanical force required to move the package wafer away from the carrier by sliding, lifting, or rotating creates additional stress that can cause the package wafer to break or damage in the microscopic circuits of the individual components is caused, which can lead to a defect and loss of performance of the device.
    Debonding by means of thermal decomposition (TD) is also susceptible to breakage of the wafer. Gases are produced as the polymer adhesive decomposes and these gases can be trapped between the device wafer and the carrier before the majority of the adhesive has been removed. The accumulation of trapped gases can cause the thin building block wafer to form or even break bubbles and cracks. Another problem with TD debonding is that the degradation of the polymer is often accompanied by the formation of stubborn, carbonized residues which are not removed by conventional cleaning procedures from the construction wafer. US Pat can be.
    The limitations of these prior art methods for debonding polymer adhesives have created a need for new types of carrier assisted handling of thin wafers that provide high wafer throughput and reduce or eliminate the likelihood that the package wafer breaks and damage occurs inside the device.
    SUMMARY OF THE INVENTION
    The present invention generally provides a novel method of temporary bonding. In one embodiment, the method includes providing a stack comprising: a first substrate having a backside and a building block side, the building block side having a peripheral area and a central area. The stack also includes a second substrate comprising a support surface and a marginal bond bonded to said peripheral region and said support surface. The edge bond is absent from at least part of said central area with the aim of being able to form a fill zone; wherein a filler material is present in the filling zone. The method also includes separating the first and second substrates.
    In another embodiment, the method includes providing a first substrate having a front side and a back side, the front side having a peripheral portion and a central portion. An edge bond is formed on the peripheral area and the edge bond is absent on at least a part of said central area. A filling material is stored in the central area.
    In yet another embodiment, the invention provides an article comprising a first substrate having a front side and a back side. The front surface of the first substrate has a peripheral portion and a central portion. The article also includes a marginal bond bonded to the peripheral region, the marginal bond not being present on at least a portion of the central region for the purpose of forming a filling region which receives therein a filler material.
    In a further embodiment, the invention relates to an article comprising a substrate having a front surface and a back surface. The front surface of the substrate has a peripheral region and a central region, and there is a material layer on the front side at the central region. The layer is absent at the peripheral area and is selected from the group consisting of a low adhesion layer and front surface modification.
    BRIEF DESCRIPTION OF THE DRAWINGS
    Figure 1 is a schematic drawing showing an embodiment for the Bon of the substrates according to the invention; Figure 2 is a schematic drawing showing an alternative embodiment of the present invention wherein two of the process steps have been reversed; Figure 3 is a schematic drawing showing an alternative embodiment of the invention wherein a laminate can be used as the filling layer; Figure 4 is a schematic drawing showing a further alternative embodiment of the invention wherein a second layer adjacent to the filling layer is used; Figure 5 is a schematic drawing showing a possible commercial change of the embodiment of Figure 4; Fig. 6 is a schematic drawing showing another modification of the present invention. 4/23 Austrian Patent Office AT12 755U1 2012-11-15
    DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
    Figure 1 shows a process by means of which the peripheral bonding of the present invention can be carried out. Referring to step a (of Figure 1), a precursor structure 10 is shown in schematic and cross-sectional view. The structure 10 includes a first substrate 12. In this embodiment, the first substrate 12 is a package wafer. That is, the substrate 12 has a front surface or chip surface 14, a back surface 16 and an outermost edge 17. Although the substrate 12 may take on any shape, this shape will typically be circular. Regardless of the shape, the front surface or module surface 14 has a peripheral region 18 and a central region 20.
    The preferred first substrates 12 include package wafers whose package surfaces include package regions selected from the group consisting of integrated circuits, microelectromechanical systems (MEMS), microsensors, power semiconductors, light emitting diodes, photonic circuits, interposers, embedded passive devices, and others Microcomponents that are made on or from silicon or other semiconducting materials such as silicon germanium, gallium arsenide and gallium nitride exist. The surfaces of these devices usually comprise structures formed of one or more of the following materials: silicon, polysilicon, silicon dioxide, silicon oxynitride, metals (e.g., copper, aluminum, gold, tungsten, tantalum), low k dielectrics , Polymer dielectrics and various metal nitrides and metal silicides. The package surface 14 may also include protruding structures, such as solder bumps, metal posts, and metal posts.
    On the chip surface 14 of the substrate 12, a filler material is applied to form a filling layer 22. The fill layer 22 has first and second surfaces 24, 26 as well as an outermost portion 28. It is preferred that the fill layer 22 be applied to have a thickness (measured at its thickest point) of from about 5 pm to about 100 pm, more preferably from about 5 pm to about 50 pm, and even more preferably from about 10 pm to about 30 pm.
    The application of the filling material may be carried out by any conventional means including spin coating, solution coating (for example, miniskus coating or roller coating), inkjet coating and spray coating. When the application is carried out by means of a spin coating, the material forming the filling layer 22 is typically spin coated at speeds between about 500 revolutions per minute and about 5,000 revolutions per minute for a period between about 60 seconds and about 20 seconds , The layer is then near or above the boiling point of the solvent or solvents present in the fill layer 22 (for example, between about 80 ° C and between about 150 ° C) for a period of time between about 1 Annealed for about 15 minutes to reduce the residual level of solvent in the fill layer 22 to less than about 1 percent by weight.
    The fill layer 22 is typically formed from a material comprising monomers, oligomers and / or polymers dispersed or dissolved in a solvent system. When the fill layer is spin coated, it is preferred that the solids content of this material be between about 1 weight percent and about 50 weight percent, more preferably between about 5 weight percent and about 40 weight percent, and even more preferably between about 10% and about 30% by weight. Examples of suitable monomers, oligomers and / or polymers include those selected from the group consisting of cyclic olefin polymers and copolymers and amorphous fluoropolymers having a high atomic fluorine content (> about 30% by weight), such as For example, fluorinated syloxane polymers, fluorinated ethylene-propylene copolymers exist, with polymers having perfluoroalkoxy side groups, and copolymers of tetrafluoroethylene and 2,2-bis-trifluoromethyl-4,5-difluoro-1,3-dioxole being particularly preferred. It is desired that the bond strength of these materials be dependent on their specific chemical structures and the coating and annealing conditions used in the application of the materials mentioned.
    Examples of suitable solvent systems for cyclic olefin polymers and copolymers include solvents selected from the group consisting of aliphatic solvents such as hexane, decane, dodecane and dodecene; alkyl substituted solvents such as mesitylene and mixtures thereof. Suitable solvents for amorphous fluoropolymers include fluorocarbon solvents sold, for example, by 3M Corporation under the trademark FLUORINERT®.
    In another embodiment, the fill layer 22 may also be formed of a polymeric material containing dispersed nanoparticles. Suitable nanoparticle materials include those selected from the group consisting of alumina, ceria, titania, silica, zirconia, graphite, and mixtures thereof.
    The material of which the filling layer 22 is formed should remain stable at temperatures between about 150 ° C and about 350 ° C, and preferably between 200 ° C and about 300 ° C. In addition, this material should be stable to the chemical exposure conditions encountered in particular backside processes to which these materials are exposed. The filler layer 22 should not degrade (i.e., less than about 1% weight loss) or otherwise lose its mechanical integrity, for example, by melting under these conditions. The fill layer 22 should also not exhibit degassing, which may cause the thin building block wafers to bubble or deform, particularly when exposed to high vacuum processes, such as during deposition of CFD dielectric layers.
    In this embodiment, the filling layer 22 preferably does not form strong adhesive bonds, thereby facilitating separation later. Generally speaking, amorphous polymeric materials are desired which: (1) have a low surface free energy; (2) free of bond strength and known to not strongly bond to glass, silicon, and metal surfaces (ie, that said polymer materials typically have very low concentrations of hydroxy acid or carboxylic acid groups and preferably have no such groups) ; (3) can be molded from the solution or into a thin film for lamination; (4) flow under typical bonding conditions to topographically fill the package wafer surface forming a void-free bonding layer between the substrates; and (5) does not crack, flow or redistribute under mechanical stresses encountered during backside machining, even when processing is performed at high temperatures or under high vacuum conditions. As used herein, the low surface free energy is defined for a polymeric material having a contact angle with the water of at least 90 ° and a critical surface tension of less than about 0.4 mN per cm, preferably less than about 0.3 mN per cm and more preferably between about 0.12 mN per cm and about 0.25 mN per cm, as determined by the contact angle measurements.
    Low bond strength refers to polymeric materials which do not stick or which can be released from a substrate with only a light hand pressure, as used, for example, to peel off a sticky note sheet. Thus, materials having a bond strength of less than about 344.5 kPa, preferably less than about 241.15 kPa, and more preferably between about 6.89 kPa and about 206.7 kPa, are desirable for use as fill layer 22. As used herein, the adhesive strength is determined by ASTMD4541 / D7234. Examples of suitable polymeric materials exhibiting the above properties include some cyclic olefin polymers and copolymers sold under the trademarks APEL® by Mitsui, Topaz by Ticona and Zeonor by Zeon Brands and solvents of soluble fluoropolymers such as CYTOP® by Asai Glass sold and Teflon® AF polymers sold by Dupont. The adhesive strength of this material depends on the coating conditions and annealing conditions used to apply the materials mentioned.
    Next, referring to step (b) of Fig. 1, the outermost part 28 of the filling layer 22 is removed. This can be accomplished by any means that allows removal of the desired amount without damaging the first substrate 12, including dissolving the outermost part 28 with a solvent known to be a good solvent for the material. from which the filling layer 22 is formed. Examples of such solvents include those selected from the group consisting of aliphatic solvents (for example, hexane, decane, dodecane, and dodecene), fluorocarbon solvents, and mixtures thereof. After the edge removal, the filling layer 22 has an outermost edge 30 which is a distance "D" from the outer edge 17. Typically, "D" is between about 2 mm and about 15 mm, preferably between about 2 mm and about 10 mm, and more preferably between about 2 mm and about 5 mm. The contact with the edge removal solvent may be maintained for a sufficient time to dissolve the desired amount of fill layer 22 to achieve the desired distance "D", but typical contact times are between 5 seconds and about 60 seconds.
    Referring to step "c" of Figure 1, a second substrate 32 is shown. In this particular embodiment, the second substrate 32 is a carrier substrate. The second substrate 32 includes a support surface 34, a back surface 36, and an outer edge 38. As was the case with the first substrate 12, the second substrate 32 may have any shape, although it is typically circular in shape. In addition, the second substrate 32 is preferably dimensioned to be approximately the same size as the first substrate 12, such that the outer edge 38 of the second substrate 32 lies substantially along the same plane as the outer edge 17 of the first substrate 12. Regardless of the shape, the support surface 34 has a peripheral region 40 and a central region 42.
    Preferred substrates 32 include a material selected from the group consisting of silicon, sapphire, quartz, metals (for example, aluminum, copper, steel), and various glasses and ceramics. The substrates 32 may also include other materials applied to the surface 34 of said substrate. For example, silicon nitride may be deposited on a silicon wafer to change the bonding properties of the fill layer 22.
    The second substrate 32 is brought into contact with the filling layer 22, leaving a cavity 44 between the peripheral region 18 of the first substrate 12 and the peripheral region 40 of the second region 32. This contact is preferably made under heat and pressure to cause the material making up the filling layer 22 to be shaped substantially uniformly along the conveying surface 14 of the first substrate 12 as well as along the support surface 34 of the second substrate 32 distributed. The pressure and heat are adjusted based on the chemical makeup of the fill layer 22 and are selected so that the distance "D" remains substantially the same after pressing the second substrate 32 onto the first substrate 12 as it did before compression was. That is, the fill layer 22 flows little or not into the void 44 and the distance "D" after compression is within approximately 10% of the distance "D" prior to compression. The typical temperatures during this step are between about 150 * 0 and about 3750, and preferably between about 1600 and about 3500, with typical pressures between about 1000 N and about 5000 N, and preferably between about 2000 N and about 4000 N.
    Next, a bonding material is introduced into the void 44 (see step "d" of Fig. 1) to form a marginal bond 46 having a thickness similar to that described above with respect to Figs Fill layer 22. Since the void 44 was confined to the outer circumference of the substrates 12 and 32, the end-bond 46 is likely to be limited. In cases where the substrates 12 or 32 have a circular shape, the edge bond 46 is annular. Thus, there is no uniform material distribution over the substrates 12 and 32 and not so as in the adhesives of the prior art, which have a uniform layer of the same material between and on the two substrates 12, 32.
    The edge bonding material can be introduced by any number of means with a suitable mechanism, a suitable mechanism being the use of a dispensing instrument with a needle, syringe or tip to disperse the material in the void space 44, while the Structure 10 slowly rotates until the void 44 is filled with the bonding material, thereby forming the edge bond 46. The edge bond 46 may also be made via capillary filling of the void 44 or via a chemical vapor coating. In a particular coating process, a liquid (100% solids or solution) edge bonding material is spin coated onto the edge of the carrier or building block wafer using a edge deflection system before the substrates 12 and 32 are brought into contact. One such system is provided by Dalvi-Malhotra et al., "Using a Silane-based Primer on Silicon Wafers to Enhance the Adhesion of Coatings Serving to Protect the Edge During Wet Etching: Application of the TALON Wrap ™ Process" Proceedings of SPIE, Vol. 6462, 2007, pp. 64620B-1 to 64620B-7, incorporated herein by reference. The edge bond 46 is then subjected to a suitable post-treatment or curing process (for example, UV cure).
    The materials of which the edge bond 46 is formed should be capable of forming a strong adhesive bond with the substrates 12 and 32. For any adhesive having an adhesion force greater than about 344.5 kPa, preferably between about 551.2 kPa and about 1722.5 kPa, and more preferably between about 689 kPa and about 1033.5 kPa, use as a Randbond is desired. In addition, the adhesion force of the edge bond 46 is at least about 3.5 kPa, preferably at least about 137.8 kPa, and preferably at least about 344.5 kPa greater than the adhesion force of the filling layer 22. In addition, the material from which the edge bond 46 is formed, satisfy the thermal and chemical stability requirements of backside machining. The edge bond 46 should remain stable at temperatures between about 150 ° C and about 350 ° C, and preferably between about 200 * 0 and about 300 ° C. In addition, the material should remain stable under the chemical exposure conditions encountered in backside treatments to which the bonded stack is exposed. The Randbond should not degrade (ie, lose as much as 1% of its weight) or otherwise lose its mechanical integrity at the temperatures of the backside processing described above. Nor should these materials release volatile compounds which could cause blistering of the thin building block wafers, especially when exposed to high vacuum processes such as CVD dielectric deposition.
    Preferred edge sealing and edge bonding materials include temporary bonding compositions that are commercially available, such as Waferbond materials (sold by Brewer Science Inc. Rolla, MO), together with resins and polymers containing a Have adhesion to semiconductor materials, glass and metals. Particularly preferred are: (1) high-solids UV-curable resin systems such as reactive epoxies and acrylic resins; (2) relatives in thermosetting resin systems such as two-part epoxy and silicone adhesives; (3) thermoplastic acrylic, styrene, vinyl halide (non-fluorine containing) and vinyl ester polymers and copolymers together with polyamides, polyimides, polysulfones, polyethersulfones and polyurethanes applied from a melt or as solution coatings, which are then annealed after application to dry and seal the peripheral regions 18 and 40; and cyclic olefins, polyolefin rubbers (for example, polyisobutylene), and adhesion-producing hydrocarbon-based resins. As was the case with materials that were used to form the filling layer 22, it is desirable that the 8/23 Austrian Patent Office AT12 755U1 2012-11-15
    Bond strength of the edge bonding materials also depend on the specific chemical structure and the coating and temperature conditions used to apply said materials.
    At this stage, the first substrate 12 may be securely handled and subjected to further processes that would otherwise damage the first substrate 12 without being bonded to the second substrate 32. Thus, the structure can be safely subjected to backside processing such as backside grinding, CMP, etching, metal and dielectric coating, patterning (eg, photolithography, via etching), passivation, annealing, and combinations thereof, without separation of the substrates 12 and 32, and without filtering any chemicals found between the substrates 12 and 32 during the following processing steps in the central regions 20 and 42.
    Advantageously, the dried and cured layers of the stacked structure in this embodiment and all other embodiments have a number of very desirable properties. That is, annealing at temperatures between about 150 ° C and about 300 ° C for up to about 60 minutes results in a film density change of the fill layer 22 and the edge tape 46 of less than 5%, preferably less than 2%, and even more preferably less than 1%. Thus, the dried layers can also be heated to temperatures up to about 350 ° C, preferably up to about 320 ° C, and more preferably up to 300 ° C, without chemical reactions occurring in the layer. In some embodiments, the layers in the bonded stack may also be exposed to polar solvents (e.g., N-methyl-2-pyrrolidone) at a temperature of about 80 ° C for about 15 minutes without reaction or dissolution.
    The bond integrity of the edge bond 46 can be maintained even after exposure to an acid or base. That is, a dried edge bond 46, having a thickness of about 15 pm, at room temperature for about 10 minutes in an acidic medium (for example, a concentrated sulfuric acid) or at 85 ° C for about 45 minutes in a basic medium (for Example, 30 wt.% KOH) while maintaining bond integrity. Bond integrity can be evaluated by using a glass substrate and then visually observing the edge bond 46 through the glass substrate to test for bubbles, voids, etc.
    Once the desired processing is completed, the first substrate 12 and the second substrate 32 can be easily separated. In a separation process, the edge bond 46 is first resolved by means of a solvent or other chemical agent. This can be accomplished by immersion in the solvent or by spraying a jet of solvent onto the edge bond 46 to dissolve it. The use of thermoplastic materials is particularly desirable when a solvent must be used to break the edge bond 46. Solvents typically used during this removal process may include those selected from the group consisting of ethyl lactate, cyclohexanone, N-methyl pyrrolidone, aliphatic solvents (eg, hexane, decane, dodecane, and dodecene) and mixtures thereof ,
    The substrates 12 and 32 may also be replaced by a first mechanical fracture or destruction of the continuity of the edge bond 46 using laser ablation, plasma etching, water jet, or other high energy techniques that effectively etch or edge bond 46 decompose, be separated. It is also convenient to first saw through or cut through the edge bond 46 or to split the edge bond 46 by equivalent means.
    Regardless of which of the above means are used, a low mechanical force (for example, a finger pressure, and a gentle wedge) can be applied to completely separate the substrates 12 and 32. In an advantageous manner and in contrast to the 9/23 Austrian Patent Office AT 12 755 Ul 2012-11-15
    The prior art bonding process does not require the separation to overcome strongly adherent bonds between the fill layer 22 and the substrates 12 or 32. Instead, it is only necessary to detach the adhesive bonds at the edge bond 46 in the peripheral regions 18 and 40 for the separation to be achieved. The surfaces of the substrates 12 and / or 32 may then be rinsed clean with a suitable solvent as required to remove any remaining material.
    While the main process has been described above in order to practice the present invention, there are still numerous alternative embodiments of the invention. For example, the above embodiment describes the first substrate 12 as a device wafer and the second substrate 32 as a carrier substrate. It can also be accepted that the first substrate 12 is the carrier substrate and the second substrate 32 is the package wafer. In this case, the front side 14 of the first substrate 12 is not a module surface, but a support surface. Also, the surface 34 of the second substrate 32 is not a support surface but instead a device surface. In other words, the fill layer may be applied to the carrier rather than the device wafer, achieving the same quality of stacked structure during the subsequent bonding step.
    In addition, the above embodiment describes the sequential application of the fill layer 22 and the edge bond 46 to the same substrate 12. It is thus appropriate to fill one of the following fill layer 22 and edge bond 46 onto the first substrate 12 and then the other of the following elements 22 and Randbond 46 on the second substrate 32 apply. The first and second substrates may then be compressed in a side-to-side relationship under the influence of heat and / or pressure with the target, as described above, to bond the two substrates together.
    Finally, while it is preferred in some embodiments that the fill layer 22 does not form strong adhesive bonds with either the package face 14 or the carrier surface 34, in other embodiments it may be desirable to form a fill layer 22 such that it does not only interfit with the block surface 14 or the support surface 34 forms strong adhesive bonds.
    Referring to Figure 2, another alternative embodiment of the present invention is shown, wherein like parts are numbered as in Figure 1. As shown in this figure, substrates 12 and 32, fill layer 22, and edge bond 46 are formed from the same materials as illustrated above with respect to FIG. 1, except that the process order has been changed. That is, referring to step (c) of FIG. 2, the bonding material or sealant used to form the edge bond 46 enters the void 44 after deposition of the fill layer 22 but before the second substrate 32 is in contact with the fill layer 22 is applied (shown in step (d ')).
    As was the case with the embodiment of FIG. 1, the first substrate 12 may be the carrier substrate and the second substrate 32 may be the device wafer. In this case again, the front surface 14 of the first substrate 12 is not a building block surface, but rather a support surface. Also, the surface 34 of the second substrate 32 is not a support surface, but instead a device surface. This alternative arrangement is particularly advantageous because the structure 10 shown in step (c ') of Figure 2 can be made by having the first substrate 12 as a carrier wafer. This structure is then provided to an end user who bonds a building block wafer to the structure and subjects the stack to further processing. Thus, for further convenience, the end user has a carrier ready for an adhesive, which then eliminates processing steps.
    FIG. 3 shows yet another embodiment of the present invention, wherein like parts are numbered the same again. In this embodiment, the fill layer 22 is provided as a laminate that adheres to the first substrate 12 under heat, pressure, and / or vacuum as required for the particular material to ensure that no voids exist between the fill layer 22 and front side surface 14 (see step 10/23 Austrian Patent Office AT12 755U1 2012-11-15 (A) of Figure 3). The laminate is precut into the appropriate shape (for example, a circular shape) or mechanically trimmed after application to produce the appropriately sized cavity 44, as described above. The bonding or sealing material used to form the edge bond 46 is applied to the cavity 44 after the application of the laminate used to form the fill layer 22 and before contacting the second substrate 32 with the fill layer (in steps (C) shown).
    As was the case with the embodiments of FIGS. 1 and 2, the first substrate 12 may be the carrier wafer and the second substrate 32 may be the package wafer. In this case again, the front surface 14 of the first substrate 12 is not a building block surface but rather a support surface. Also, the surface 34 of the second substrate 32 is not a support surface but instead a device surface. As was the case with the embodiment of Figure 2, this alternative arrangement is particularly advantageous since the structure 10 shown in step (B) of Figure 3 can be fabricated, with the first substrate 12 being provided as a support substrate. This structure could then be provided to the end user, who would bond a building block wafer to the structure and expose the stack to further processing.
    A further alternative embodiment is shown in Fig. 4, wherein like numbers are used to represent like parts. A structure 48 is shown. The structure 48 is similar to the structure 10 shown (and similarly shaped) in step (d) of FIG. 1 except that the structure 48 also includes a second layer 50. The layer 50 may be a low adhesion layer, such as, for example, a release coating (eg, a release agent) that is applied to facilitate separation after backside processing or other processing. The use of the non-stick coating reduces the requirement for the fill layer 22 to form a non-adherent interface or interface with a low adhesive force to the first or second substrate 12 or 32.
    Instead of assuming the form of a layer having a low adhesive force, the layer 50 (not to scale) may also represent a region on the front surface 14 of the first substrate 12 which has been chemically modified with the target, a layer or a surface layer which is permanently non-adherent or to obtain a surface layer to which a filler material can not be strongly bonded. Such modifications may include, for example: (a) a chemical treatment of a silicon surface with a hydrophobic organic silane such as a fluoroalkylsilane (eg, perfluoroalkyltrichlorosilane) or a fluoroalkylphosphonate to reduce surface free energy; or (b) a chemical vapor deposition with a coating having a low surface free energy (for example fluorinated parylene or AF4-parylene) on the support to create a permanent non-adherent surface. The advantage of this approach is that the filler layer (s) can be selected for any combination of properties (thickness, solubility, thermal stability), which may be related to providing an adhesion-rejecting property or a low adhesive force differentiates to the substrate. When an area change is made, the thickness of the layer 50 is generally on the order of about 1 nm to about 5 nm.
    Finally, the layer 50 may be a second polymer layer, rather than being a low adhesion layer or surface modification layer. The layer 50 may also be a polymer coating selected from the group consisting of cyclic olefin polymers and copolymers having a low adhesion force to the substrate 12 or 32 on which said polymer coating has been applied or to the fill layer 22 the said polymer layer may be in contact or the layer 50 may also be a permanent tack-free layer, such as a fluoropolymer coating (for example, the coating under the name Teflon® from DuPont). If the layer 50 is a polymer layer having a low adhesive force, it is preferred at 11/23 Austrian Patent Office AT12 755U1 2012-11-15
    A method with a thickness of at least about 1 gm and about 10 gm applied (for example with a spin coating).
    The use of a polymer coating as layer 50 allows customization benefits to the end user. For example, the layer 50 may form an interface with no adhesion or low adhesion to the first substrate 12 to facilitate easy separation from this substrate once the edge bond 46 has been broken or removed while the fill layer 22 is fixed to the substrate second substrate 32 has been bonded. The advantage of this configuration is that the fill layer 22 can be very thick (up to several hundreds of microns) and can be selected with a fast resolution in a cleaning solvent, but no non-adhesive interface or low adhesion interface with the first Substrate needs to form or the roles of the layers can be reversed. The deposition of the layer 50 and the fill layer 22 may be sequentially performed on the first substrate, or alternatively the two layers may be separately coated, with one of the layers 50 or 22 first placed on each substrate and then contacted ,
    Regardless of which layer 50 is used, it should not be mixed with the filler layer 22, be dissolved in it, or react with it.
    In addition, the layer 50 should be selected to be uniformly coated without voids or other defects.
    As was the case for the previously discussed embodiments, the substrates 12 and 32 may be reversed such that the first substrate 12, the carrier substrate, and the second substrate 32 are the package wafers. Again in this case, the front surface 14 of the first substrate 12 is not a building block surface, but rather a support surface. The surface 34 of the second substrate 32 is also not a carrier surface but instead a block surface. This alternative arrangement is again advantageous because the structure 48 'shown in Figure 5 can be fabricated to provide the first substrate 12 as a carrier wafer. This structure can then be made available to the end user, who bonds a building block wafer to the structure and exposes the stack to further processing. Thus, as with the previous embodiments, an adhesive carrier is available to the end user for added convenience, eliminating processing steps for the end user.
    A further embodiment of the invention is shown in FIG. In this embodiment, the structure 32 is similar to the structure 48 'shown in FIG. 5 except that the structure 32 includes only the substrate 12 and the layer 50. In this embodiment, the substrate 12 is preferably a carrier substrate, such as those described above. This structure may be provided to an end user who then uses them as a carrier substrate to hold a package wafer during processing.
    Finally, the materials used to form the fill layer 22, the edge bond 46, and the layer 50 have been described above. It is desired that the mechanisms for curing or curing these materials can be rapidly selected and adapted by those skilled in the art. For example, in some embodiments, it may be desirable to use a non-curing composition for easier dissolution in the later removal and cleaning processes. For each of these materials are thermoplastic or rubber-like compositions which (typically have a mean molecular weight of at least about 5,000 daltons), resin type or rosin type compositions (typically having a weight average molecular weight of less than about 5,000 daltons), and mixtures of the foregoing compositions.
    In other embodiments, a thermoset is more suitable and thus a composition is selected which cures or crosslinks upon heating. This would require the use of a crosslinking agent or possibly a catalyst in the system, as well as a step that induces cross-linking.
    In yet another embodiment, a photocurable system is preferred. This system requires the use of a free radical photoinitiator or photogenerated catalyst in the system as well as a step (for example, exposure to UV light) to induce cure. This system provides an advantage in cases where the system can be used as a 100% solids composition, if necessary.
    It is desirable that the above description can be used to fabricate a number of integrated micropumps, including those selected from the group consisting of silicon based semiconductor devices, compound semiconductor based devices, embedded passive device regions, ( resistors, capacitors, chokes), MEMS devices, microsensors, photonic devices, light emitting diodes, thermal management devices, and planar packaging substrates (e.g., interposers) to which one or more of the foregoing devices have been attached or attached.
    EXAMPLES
    The following examples describe preferred methods of the invention. It should be understood, however, that these examples are provided for illustration and that nothing in these examples is to be understood as a limitation on the overall scope of the invention. EXAMPLE 1 Adhesively Bonded to Edge Surface and Chemically Modified to Central Surface An epoxy-based photoresist (SU-8 2002, Microchem, Newton, MA) was coated on the surface of a 100-mm silicon wafer (Wafer 1) on the outside Rand distributed to coat a portion of the wafer surface, which was about 3-5 mm wide. A fluorinated silane ((heptadecafluoro-1,1,2,2-tetrahydradecyl) trichlorosilane) was dissolved in a 1% solution using an FC-40 solvent (a perfluoro compound mainly containing C12 sold under the name Fluorinert from 3M). The solution was spin-coated on the surface of the wafer 1. The wafer 1 was sintered on a hot plate at 100 ° C. for 1 minute. The wafer was then rinsed with the FC-40 solvent in a spin coater and additionally sintered at 100x0 for 1 minute. The epoxy-based photoresist was removed using acetone in a rotary coater with the edge not treated by the fluorinated silane solution.
    The surface of another 100-mm silicon wafer (wafer 2) was coated with a bonding composition (WaferBOND® HTIO.10.by Brewer Science Inc. Rolla, MO) by means of spin coating. This wafer was sintered at 110 ° C for 2 minutes followed by 1600 for 2 minutes. The coated wafers were bonded in vacuum at 220 ° C for 3 minutes in a heated vacuum and in a pressure chamber in a side-by-side configuration. These wafers were debonded by the introduction of a razor blade at the edge between the two wafers. After separation, a 3-5 mm wide ring of the bonding composition coating was transferred to the edge of the wafer 1 while the remainder of the coating remained on the wafer 2. Both wafers may be considered as package wafers or carrier wafers in this example. EXAMPLE 2 Adhesively bonded to the edge surface, chemically modified at the central surface, and debonded using a solvent jet on the edge of a wedge shape. An epoxy-based photoresist was coated on the surface of a 200-mm silicon wafer 13/23 Austrian Patent Office AT12 755U1 2012-11-15 (Wafer 1) was spread on the outer edge to coat part of the wafer area that was about 3-5 mm wide. A fluorinated silane ((heptadecafluoro-1,1,2,2-tetrahydradecyl) trichlorosilane) was dissolved in a 1% solution using an FC-40 solvent. The solution was spin-coated on the surface of the wafer 1. The wafer 1 was sintered on a hot plate at 100 ° C. for 1 minute. The wafer was then rinsed with the FC-40 solvent in a spin coater and additionally sintered at 100 ° C for 1 minute. The epoxy-based photoresist was removed using acetone in a rotary coater with the edge not treated by the fluorinated silane solution.
    The surface of another 200-mm silicon wafer (wafer 2) was coated with a wafer BOND® HTI 0.10 bonding composition by means of spin coating. This wafer was sintered at 110 ° C for 2 minutes and 160 ° C for 2 minutes. The coated wafers were bonded together in a side-by-side configuration under vacuum at 220 ° C for 2 minutes in a heated vacuum and pressure chamber. The wafers were debonded by Dodecen, the solvent in WaferBOND® HTI 0.10, directly on the edge of the bonded wafers to dissolve the bonding composition while the wafers were rotated to expose the edge of the bonded wafers to the solvent. After the solvent triggered the material to about 0.5-1 mm from the edge, a sharpened round disc was inserted at the edge between the wafers while they were still rotating. As a result, the bonding composition was marginal and the wafers were separated. After separation, only a 3-5mm wide edge of the HTI0.10 coating was transferred to the edge of the wafer 1 while the remainder of the coating remained on the wafer 2. Both wafers in this example may be considered as package wafers or carrier wafers. EXAMPLE 3 Adhesively bonded to the edge surface and coating the center surface with a release material.
    An epoxy-based negative photoresist (sold under the name SU-8 2010 by MicroChem) was spin-coated on the surface of a 100 mm glass wafer. The wafer was sintered at 110 ° C for 2 minutes. A Teflon® AF solution (Teflon® F2400 in FC-40, from DuPont) was spin-coated on SU-8 2010. Then, the FC-40 solvent was spread on the surface of the wafer at the outer edge to remove a 3-5 mm wide portion of the Teflon® AF coating from the wafer surface. The wafer was sintered at 110 ° C for 2 minutes. The wafer was bonded in a side-by-side configuration with a 100 mm silicon wafer blank in vacuum at 120 ° C for 3 minutes in a heated vacuum and pressure chamber. The bonded wafers were exposed to broad band UV light from the outside of the glass wafer. The exposed wafers were sintered at 120 ° C for 2 minutes to crosslink the SU-8 2010 coating. These wafers were debonded by the introduction of a razor blade at the edge between the two wafers. After separation, a 3-5 mm wide ring of the bonding composition coating was transferred to the edge of the wafer 1 while the remainder of the coating remained on the wafer 2. Both wafers may be considered as package wafers or carrier wafers in this example. EXAMPLE 4 Adhesively Bonded to Edge Surface and Coating of Central Area with Adhesion Promoter A silicone acrylate copolymer was prepared by first mixing the following compositions to prepare a monomer solution: 624 g of methacryloxypropyl-tris (tris-methylsiloxy) silane; 336 g of glycidyl methacrylate; and 9.6 g of dicumyl peroxide. Next, 1430.4 g of 1-butanol was added to a reactor and heated to 11 ° C for one hour. The monomer solution was added dropwise over 4 hours, and the poly (14/23
    权利要求:
    Claims (42)
    [1]
    Austrian Patent Office AT12 755U1 2012-11-15 was carried out for 20 hours at 116 ^ 0 to obtain a silicone acrylate copolymer solution having a percentage of 40.4%. The copolymer solution was spin-coated on the surface of a 100-mm silicon wafer (wafer 1). Then 1-butanol was applied to the surface of the wafer at the outer edge to remove approximately a 3-5 mm wide portion of the silicone acrylate copolymer coating from the wafer surface. The wafer was sintered on a hot plate at 110 ° C for 2 minutes. The surface of another 100 mm silicon wafer (wafer 2) was spin-coated with Brewer Science's WaferBOND® HT 10.10 wafer bonding composition. This wafer was then sintered at 110 ° C for 2 minutes and 160 ° C for 2 minutes. The coated wafers were bonded in a side-by-side configuration with each other under vacuum at 220 ° C for 3 minutes in a heated vacuum and a pressure chamber. These wafers were debonded by the introduction of a razor blade at the edge between the two wafers. After separation, a 3-5 mm wide ring of the HTI0.10 coating remained on the edge of the wafer 2 while the remainder of the coating remained on the wafer 2. Both wafers may be considered as package wafers or carrier wafers in this example. EXAMPLE 5 Bonding at the edge surface and filling the central surface with a material having low adhesion to both substrates The Teflon® AF solution used in Example 3 was coated on the surface of a 100 mm silicon wafer (Wafer 1) rotationally coated. Subsequently, the FC-40 solvent was applied to the surface of the wafer at the outer edge to remove approximately a 3-5 mm wide portion of the Teflon® AF coating from the wafer surface. The wafer was sintered at 110 ° C for 2 minutes. The edge of the wafer was coated with a WaferBOND® HTI 0.10 bonding composition by spin coating, with the material applied only at the periphery. The wafer was bonded in a side-by-side configuration with a 100 mm silicon wafer blank (wafer 2) under vacuum at 220 ° C for 2 minutes in a heated vacuum and pressure chamber. The wafers were debonded by inserting a razor blade on the edge between the two wafers. After the separation, the wafer 2 had only one edge of the bonding material on the outer 3-5 mm while there was no material transfer to the center. Both wafers may be considered as package wafers or carrier wafers in this example. Claims 1. A method of separating temporarily bonded substrates (12, 32) comprising: - providing a stack (10) comprising; - a first substrate (12) having a back surface (16) and a building block side (14), said building side (14) having a peripheral area (18) and a central area (20), said building area (14) comprising an array of Comprising building blocks selected from the group consisting of integrated circuits, microelectromechanical systems (MEMS), microsensors, power semiconductors, light-emitting diodes, photonic circuits, interposers, embedded passive devices and micro-devices based on or consisting of silicon, silicon germanium, gallium arsenide and gallium nitride, - a second substrate (32) having a support surface (34); and an edge bond (46) bonded to said peripheral region (18) and said support surface (34), said edge bond (46) not being present in said central region (20) to form a fill zone; and a filling material (22) in said filling zone, the filling material (22) having an adhesive strength of less than about 344.5 kPa; - Separating said first and second substrates.
    [2]
    The method of claim 1, wherein said second substrate (32) comprises a material selected from the group consisting of silicon, sapphire, quartz, metal, glass, and ceramic.
    [3]
    The method of claim 1, wherein said package surface (14) comprises at least one structure selected from the group consisting of solder bumps, metal pillars, metal pillars, and structures formed from a material selected from the group consisting of Silicon, polysilicon, silicon dioxide, silicon oxynitride, metal, low-k dielectrics, polymer dielectrics, metal nitrides and metal silicide.
    [4]
    The method of claim 1, wherein said fill material (22) has a first surface (24) in contact with said support surface (34) and a second surface (26) in contact with said component surface (14 ), wherein said fill material (22) is a unitary material from the first (24) to the second (26) face.
    [5]
    The method of claim 1, wherein said fill material (22) has a first (24) and a second (26) surface, said stack (10) further comprising a layer (50) associated with one of said first (24). 24) and second (26) surface, the other of said first (24) and second (26) surfaces being in contact with said support surface (34) or said device surface (14).
    [6]
    The method of claim 5, wherein said layer (50) is selected from the group consisting of a layer having a weak adhesion, a polymer layer, and a surface modification of said support surface (34) or said device surface (14).
    [7]
    The method of claim 6, wherein said layer (50) is in contact with said support surface (34).
    [8]
    The method of claim 1, wherein said edge bond (46) has a width of between about 2mm and about 15mm.
    [9]
    The method of claim 1, wherein said edge bond (46) is formed of a material comprising monomers, oligomers or polymers selected from the group consisting of epoxies, acrylics, silicones, styrenes, vinyl halides, vinyl ester resins, polyamides , Polyimides, polysulfones, polyethersulfones, cyclic olefins, polyolefin rubbers and polyurethanes.
    [10]
    The process of claim 1, wherein said fill material (22) comprises monomers, oligomers and / or polymers selected from the group consisting of cyclic olefins and amorphous fluoropolymers.
    [11]
    The method of claim 1, further comprising processing said stack (10) by methods selected from the group consisting of backside grinding, chemical mechanical polishing, etching, metal and dielectric coating, surface structuring, passivation, annealing and combinations thereof, before separating said first (12) and second substrates (32).
    [12]
    The method of claim 1, further comprising exposing said edge bond (46) to a solvent to dissolve said edge bond (46) prior to said separation.
    [13]
    The method of claim 1, further comprising mechanically fracturing said boundary bond (46) prior to said separation.
    [14]
    14. The method of claim 1, wherein said separation comprises loading said first (12) and / or second (32) substrates with a weak force to pull them apart. 16/23 Austrian Patent Office AT12 755U1 2012-11-15
    [15]
    The method of claim 1, wherein said fill material (22) is in contact with said support surface (34).
    [16]
    16. An article comprising: - a first substrate (12) having a front surface (14) and a rear surface (16), said front surface (14) having a peripheral region (18) and a central region (20) first substrate (12) comprises a device wafer having a device surface (14) comprising an array of devices selected from the group consisting of integrated circuits, microelectromechanical systems (MEMS), microsensors, power semiconductors, light emitting diodes, photonic circuits, interposers, embedded ones passive devices and micro devices fabricated on or of silicon, silicon germanium, gallium arsenide and gallium nitride. - an edge bond (46) having first and second surfaces, said first surface being bonded to said peripheral region (18) and said second surface being remote from said peripheral region (18), said edge bond (46) in the central region is absent to form a fill zone, said edge bond (46) being formed from a material comprising monomers, oligomers or polymers selected from the group consisting of epoxies, acrylics, silicones, styrenes, vinyl halides, vinyl ester resins, Polyamides, polyimides, polysulfones, polyethersulfones, cyclic olefins, polyolefin rubbers and polyurethanes; and a filling material (22) in said filling zone, wherein the filling material (22) has an adhesive strength of less than about 344.5 kPa and is absent at the first and second surfaces.
    [17]
    The article of claim 16, wherein said first substrate (12) comprises a material selected from the group consisting of silicon, sapphire, quartz, metal, glass and ceramic.
    [18]
    The article of claim 16, further comprising a second substrate (32) having a support surface (34), said edge bond (46) being further bonded to said support surface (34).
    [19]
    The article of claim 18, wherein said second substrate (32) comprises a material selected from the group consisting of silicon, sapphire, quartz, metal, glass and ceramic.
    [20]
    The article of claim 16, wherein said package surface (14) comprises at least one structure selected from the group consisting of solder bumps, metal pillars, metal pillars, and structures formed from a material selected from the group consisting of silicon, polysilicon, silicon dioxide, Silicon oxynitride, metal, low-k dielectrics, polymer dielectrics, metal nitrides, and metal silicides.
    [21]
    The article of claim 16, wherein said fill material (22) has a first (24) and a second (26) surface, said article further comprising a layer (50) associated with one of said first (24) and second (26) surfaces second (26) surface is in contact.
    [22]
    The article of claim 18, wherein said filler material (22) has a first (24) and a second (26) surface, said article further comprising a layer (50) associated with one of said first (24) and second (26) surfaces second (26) surface and wherein said layer (50) is selected from the group consisting of a layer having a weak adhesive force, a polymer layer and a surface modification of said support surface (34) or said front surface (14).
    [23]
    The article of claim 22, wherein said layer (50) is in contact with said support surface (34).
    [24]
    The article of claim 16, wherein said edge bond (46) has a width of between about 2mm and about 15mm. 17/23 Austrian Patent Office AT12 755U1 2012-11-15
    [25]
    The article of claim 16, wherein said fill material (22) comprises monomers, oligomers and / or polymers selected from the group consisting of cyclic olefins and amorphous fluoropolymers.
    [26]
    26. A method of forming a wafer temporarily bonding structure, said method comprising: providing a first substrate (12) having a front surface (14) and a rear surface (16), said front surface (14) defining a peripheral region (18) and a central region (20), said first substrate (12) comprising a device wafer having a device surface (14) comprising an array of devices selected from the group consisting of integrated circuits, microelectromechanical systems (MEMS), microsensors Power semiconductors, light-emitting diodes, photonic circuits, interposers, embedded passive devices, and micro-devices fabricated on or of silicon, silicon germanium, gallium arsenide and gallium nitride. Forming a peripheral bond (46) on said peripheral region (18), said peripheral bond (46) not being present in said central region (20) and being formed of a material comprising monomers, oligomers or polymers selected from the group consisting of epoxies, acrylics, silicones, styrenes, vinyl halides, vinyl ester resins, polyamides, polyimides, polysulfones, polyethersulfones, cyclic olefins, polyolefin rubbers and polyurethanes; and depositing a filling material (22) in said central region (20), the filling material (22) having an adhesive strength of less than about 344.5 kPa.
    [27]
    27. The method of claim 26, wherein said depositing the filler (22) is performed prior to said edge bond (46) formation.
    [28]
    The method of claim 26, wherein said first substrate (12) comprises a material selected from the group consisting of silicon, sapphire, quartz, metal, glass and ceramic.
    [29]
    29. The method of claim 26, further comprising bonding a second substrate (32) having a support surface (34) to said edge bond (46).
    [30]
    30. The method of claim 29, wherein said second substrate (32) comprises a material selected from the group consisting of silicon, sapphire, quartz, metal, glass, and ceramic.
    [31]
    31. The method of claim 26, wherein said package surface comprises at least one structure selected from the group consisting of solder bumps, metal pillars, metal pillars, and structures formed from a material selected from the group consisting of silicon, polysilicon, silicon dioxide, Silicon oxynitride, metal, low-k dielectrics, polymer dielectrics, metal nitrides, and metal silicides.
    [32]
    32. The method of claim 26, wherein said fill material (22) has a first (24) and a second (26) surface, said structure (10) further comprising a layer (50) associated with one of said first (24). 24) and second (26) surface is in contact.
    [33]
    33. The method of claim 32, wherein said fill material (22) has a first (24) and a second (26) surface, said structure (10) further comprising a layer (50) associated with one of said first (24). 24) and second (26) surface, and wherein said layer (50) is selected from the group consisting of a layer having a weak adhesive force, a polymer layer and a surface modification of said support surface (34) or said front surface (14 ).
    [34]
    The method of claim 33, wherein said layer (50) is in contact with said support surface (34). 18/23 Austrian Patent Office AT12 755U1 2012-11-15
    [35]
    The method of claim 26, wherein said edge bond (46) has a width of between about 2mm and about 15mm.
    [36]
    The method of claim 26, wherein said fill material (22) comprises monomers, oligomers and / or polymers selected from the group consisting of cyclic olefins and amorphous fluoropolymers.
    [37]
    37. An article comprising: - a substrate having a front surface (14) and a rear surface (16), said front surface (14) having a peripheral region (18) and a central region (20), said substrate comprising a material selected from the group consisting of silicon, sapphire, quartz, metal, glass and ceramic, and - a layer of material (50) on said front surface (14) in said central region (20), said layer (50) not being in said peripheral region (18) is present and is selected from the group consisting of a layer having a low adhesive force and a surface modification of said front surface, said peripheral region (18) being free from the edge bond (46).
    [38]
    The article of claim 37, wherein said substrate comprises silicon.
    [39]
    The article of claim 37, wherein said peripheral region (18) has a width of between about 2mm and about 15mm.
    [40]
    The article of claim 37, wherein said layer (50) has a thickness of between about 1 nm and about 5 nm.
    [41]
    41. A method of forming a wafer temporarily bonding structure, said method comprising: providing a first substrate (12) having a front surface (14) and a rear surface (16), said front surface (14) defining a peripheral region (18) and a central region (20), said front surface (14) comprising an array of devices, said first substrate (12) comprising a material selected from the group consisting of silicon, sapphire, quartz, metal, glass and ceramics; Forming a marginal bond (46) on said peripheral region (18), said edge bond (18) not being present in said central region (20) and being formed of a material comprising monomers, oligomers or polymers derived from the Selected from the group consisting of epoxies, acrylics, silicones, styrenes, vinyl halides, vinyl ester resins, polyamides, polyimides, polysulfones, polyethersulfones, cyclic olefins, polyolefin rubbers, and polyurethanes; and depositing a filling material (22) in said central region (20), said filling material (22) having an adhesive strength of less than about 344.5 kPa.
    [42]
    42. An article comprising: - a first substrate (12) having a front surface (14) and a rear surface (16), said front surface (14) having a peripheral region (18) and a central region (20); Substrate (12) comprises a material selected from the group consisting of silicon, sapphire, quartz, metal, glass, and ceramic, and wherein said front surface (14) comprises an array of building blocks; - an edge bond (46) having first and second surfaces, said first surface being bonded to said peripheral region (18) and said second surface being remote from said peripheral region (18), said edge bond (46) in said central region (20) is absent to form a filling zone; and a filling material (22) in said filling zone, the filling material (22) having an adhesive strength of less than about 344.5 kPa and absent from the first and second surfaces. 4 sheets of drawings 19/23
    类似技术:
    公开号 | 公开日 | 专利标题
    AT12755U1|2012-11-15|PROCESS FOR TEMPORARILY INSTALLING A BUILDING UNIT ON A SUPPORTING SUBSTRATE
    AT510068B1|2019-07-15|METHOD AND DEVICE FOR REMOVING A REVERSIBLE ASSEMBLED BUILDING UNIT FROM A SUPPORTING SUBSTRATE
    US9472436B2|2016-10-18|Multiple bonding layers for thin-wafer handling
    DE102009042920B4|2013-10-10|Method for producing a semiconductor device and method for producing a plurality of semiconductor devices
    WO2013120648A1|2013-08-22|Method for the temporary connection of a product substrate to a carrier substrate
    EP2572380B1|2021-06-16|Method for producing chip stacks and a carrier for carrying out the method
    DE10340409B4|2007-05-24|Carrier wafer and method for processing a semiconductor wafer using a carrier wafer
    WO2018157937A1|2018-09-07|Method and device for bonding chips
    DE10339998B3|2005-01-27|Forming releasable bond between semiconductor substrate and support comprises using a triethoxysilylalkylamine adhesive
    DE10139056B4|2005-04-21|A method of thinning a disk-shaped article and producing a semiconductor device structured on both sides
    同族专利:
    公开号 | 公开日
    TWI439526B|2014-06-01|
    CN101925996B|2013-03-20|
    JP5111620B2|2013-01-09|
    WO2009094558A3|2009-09-24|
    DE112009000140T5|2010-11-18|
    US20090218560A1|2009-09-03|
    CA2711266A1|2009-07-30|
    JP2011510518A|2011-03-31|
    JP2012253367A|2012-12-20|
    AT508318A3|2015-12-15|
    KR101096142B1|2011-12-19|
    TW200946628A|2009-11-16|
    WO2009094558A2|2009-07-30|
    EP2238618A4|2011-03-09|
    JP5558531B2|2014-07-23|
    EP2238618B1|2015-07-29|
    IL206872D0|2010-12-30|
    PT2238618E|2015-09-03|
    EP2238618A2|2010-10-13|
    RU2010129076A|2012-01-20|
    DE202009018064U1|2010-12-02|
    AT508318A2|2010-12-15|
    US9099512B2|2015-08-04|
    CN101925996A|2010-12-22|
    US9111981B2|2015-08-18|
    KR20100095021A|2010-08-27|
    IL206872A|2015-07-30|
    US20110069467A1|2011-03-24|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    US20020061642A1|1999-09-02|2002-05-23|Matsushita Electric Industrial Co., Ltd.|Semiconductor device and method of manufacturing the same|
    EP1496547A2|2003-07-11|2005-01-12|Nitto Denko Corporation|Multilayer sheet for backside grinding of a semiconductor wafer|
    US20050221598A1|2004-03-31|2005-10-06|Daoqiang Lu|Wafer support and release in wafer processing|
    WO2005101459A2|2004-04-15|2005-10-27|Infineon Technologies Ag|Method for machining a workpiece on a workpiece support|
    US20070145602A1|2005-12-22|2007-06-28|Princo Corp.|Structure Combining an IC Integrated Substrate and a Carrier, and Method of Manufacturing such Structure|
    AT503053A2|2006-01-03|2007-07-15|Erich Thallner|COMBINATION OF A CARRIER AND A WAFER|
    US3970494A|1975-04-18|1976-07-20|Western Electric Co., Inc.|Method for adhering one surface to another|
    US4474942A|1982-06-28|1984-10-02|Takeda Chemical Industries, Ltd.|Cross-linked polyesteramide from bis|
    GB8320270D0|1983-07-27|1983-09-01|Raychem Ltd|Polymer composition|
    JPS61144839A|1984-12-18|1986-07-02|Toshiba Corp|Bonding method for semiconductor wafer|
    US4558114A|1985-01-23|1985-12-10|Ashland Oil, Inc.|Polymers derived from polyisocyanates, bicyclic amide acetals and oxazolines|
    US4710542A|1986-05-16|1987-12-01|American Cyanamid Company|Alkylcarbamylmethylated amino-triazine crosslinking agents and curable compositions containing the same|
    US4855170A|1986-08-21|1989-08-08|Minnesota Mining And Manufacturing Company|Pressure-sensitive tape construction incorporating resilient polymeric microspheres|
    JPH0266933A|1988-09-01|1990-03-07|Fujitsu Ltd|Manufacture of semiconductor device|
    NL8902683A|1989-10-31|1991-05-16|Stamicarbon|MULTIPLE COMPONENT SYSTEM BASED ON OXAZOLINE AND A PHOSPHORUS CONTAINING COMPOUND.|
    US5043250A|1990-07-17|1991-08-27|Eastman Kodak Company|Radiation-sensitive composition containing a poly and use thereof in lithographic printing plates|
    US5195729A|1991-05-17|1993-03-23|National Semiconductor Corporation|Wafer carrier|
    JPH0645436A|1992-07-22|1994-02-18|Nec Corp|Bonding method for semiconductor substrate|
    JP3656254B2|1994-02-28|2005-06-08|三菱住友シリコン株式会社|Method and apparatus for peeling adhesive wafer|
    JP2001514449A|1997-08-22|2001-09-11|キュービック・メモリー・インコーポレーテッド|Vertical interconnect method of silicon segments with thermally conductive epoxy preform|
    US5654226A|1994-09-07|1997-08-05|Harris Corporation|Wafer bonding for power devices|
    US6342434B1|1995-12-04|2002-01-29|Hitachi, Ltd.|Methods of processing semiconductor wafer, and producing IC card, and carrier|
    JP2004119975A|1995-12-04|2004-04-15|Renesas Technology Corp|Method of manufacturing ic card|
    JPH09263500A|1996-01-22|1997-10-07|Komatsu Electron Metals Co Ltd|Jig for stripping stuck soi wafer|
    DE19628393A1|1996-07-13|1998-01-15|Bosch Gmbh Robert|Device for protecting edge of wafer against etching liquid|
    US6054363A|1996-11-15|2000-04-25|Canon Kabushiki Kaisha|Method of manufacturing semiconductor article|
    SG67458A1|1996-12-18|1999-09-21|Canon Kk|Process for producing semiconductor article|
    ID21997A|1997-01-30|1999-08-19|Mitsui Chemicals Inc|HEAT-HOT ADHESIVE COMPOSITION|
    US6110999A|1998-03-06|2000-08-29|Denovus Llc|Reusable adhesive composition and method of making the same|
    KR100304197B1|1998-03-30|2001-11-30|윤종용|Method for manufacturing silicon on insulator|
    US6068727A|1998-05-13|2000-05-30|Lsi Logic Corporation|Apparatus and method for separating a stiffener member from a flip chip integrated circuit package substrate|
    KR100509059B1|1998-09-12|2005-11-22|엘지전자 주식회사|Manufacturing Method of Flexible Printed Circuit Board and Flexible Printed Circuit Board Produced by the Method|
    FR2783970B1|1998-09-25|2000-11-03|Commissariat Energie Atomique|DEVICE AUTHORIZING THE PROCESSING OF A SUBSTRATE IN A MACHINE PROVIDED FOR PROCESSING LARGER SUBSTRATES AND SYSTEM FOR MOUNTING A SUBSTRATE IN THIS DEVICE|
    FR2785217B1|1998-10-30|2001-01-19|Soitec Silicon On Insulator|METHOD AND DEVICE FOR SEPARATING IN A TWO WAFERS A PLATE OF MATERIAL, PARTICULARLY A SEMICONDUCTOR|
    JP2000138193A|1998-11-02|2000-05-16|Enya System:Kk|Method of preventing adhesion of deposit on mount plate|
    WO2000033359A2|1998-12-02|2000-06-08|Kensington Laboratories, Inc.|Specimen holding robotic arm end effector|
    JP2000208252A|1999-01-14|2000-07-28|Tdk Corp|Organic electroluminescent element|
    FR2796491B1|1999-07-12|2001-08-31|Commissariat Energie Atomique|METHOD FOR TAKING OFF TWO ELEMENTS AND DEVICE FOR IMPLEMENTING SAME|
    WO2002017695A1|2000-08-22|2002-02-28|Zeon Corporation|Method of film laminating|
    US20020137859A1|2000-04-13|2002-09-26|Kiyohiko Yokota|Process for producing alpha-olefin/aromatic vinyl copolymer|
    JP2002237516A|2001-02-07|2002-08-23|Seiko Epson Corp|Wafer protective case|
    US20020115263A1|2001-02-16|2002-08-22|Worth Thomas Michael|Method and related apparatus of processing a substrate|
    US6660330B2|2001-04-10|2003-12-09|International Business Machines Corporation|Method for depositing metal films onto substrate surfaces utilizing a chamfered ring support|
    FR2823596B1|2001-04-13|2004-08-20|Commissariat Energie Atomique|SUBSTRATE OR DISMOUNTABLE STRUCTURE AND METHOD OF MAKING SAME|
    DE10121115A1|2001-04-28|2002-10-31|Leica Microsystems|Holding device for wafers|
    US6811916B2|2001-05-15|2004-11-02|Neah Power Systems, Inc.|Fuel cell electrode pair assemblies and related methods|
    US6543808B1|2001-07-05|2003-04-08|Translucent Technologies, Llc|Direct thermal printable pull tabs|
    DE10137375A1|2001-07-31|2003-02-27|Infineon Technologies Ag|Use of polybenzoxazole polymers for adhesive bonding, especially for bonding chips and-or wafers, e.g. silicon wafers with titanium nitride-coated silicon chips|
    EP1295926A1|2001-09-19|2003-03-26|ExxonMobil Chemical Patents Inc.|Components for adhesive compositions and process for manufacture|
    JP3957506B2|2001-12-26|2007-08-15|Ｎｅｃエレクトロニクス株式会社|Substrate surface protection sheet affixing device and affixing method|
    KR20050006120A|2002-05-13|2005-01-15|제이에스알 가부시끼가이샤|Composition And Method For Temporarily Fixing Solid|
    EP1507292B1|2002-05-20|2012-05-02|Sumco Corporation|Method of manufacturing the substrate, and wafer outer periphery pressing jigs used for the method|
    JP4565804B2|2002-06-03|2010-10-20|スリーエムイノベイティブプロパティズカンパニー|Laminate including ground substrate, method for producing the same, method for producing ultrathin substrate using laminate, and apparatus therefor|
    JP4074794B2|2002-08-30|2008-04-09|ソタジャパン有限会社|Jewelery using a germanium alloy-silica composite|
    US7608336B2|2002-11-28|2009-10-27|Nippon Kayaku Kabushiki Kaisha|Flame-retardant epoxy resin composition and cured product obtained therefrom|
    JP4593068B2|2002-11-29|2010-12-08|古河電気工業株式会社|Adhesive tape for fixing semiconductor wafers|
    US7187162B2|2002-12-16|2007-03-06|S.O.I.Tec Silicon On Insulator Technologies S.A.|Tools and methods for disuniting semiconductor wafers|
    US6869894B2|2002-12-20|2005-03-22|General Chemical Corporation|Spin-on adhesive for temporary wafer coating and mounting to support wafer thinning and backside processing|
    JP4514409B2|2003-02-20|2010-07-28|日東電工株式会社|Method for temporarily fixing semiconductor wafer, electronic component, and circuit board|
    JP4171898B2|2003-04-25|2008-10-29|信越化学工業株式会社|Adhesive tape for dicing and die bonding|
    DE10320375B3|2003-05-07|2004-12-16|Süss Micro Tec Laboratory Equipment GmbH|Temporary, reversible fixing of 2 flat workpieces involves applying thin coating to sides to be joined, joining coated sides with adhesive, dissolving coatings in defined solvent to reverse connection|
    US7364616B2|2003-05-13|2008-04-29|Mimasu Semiconductor Industry Co. Ltd|Wafer demounting method, wafer demounting device, and wafer demounting and transferring machine|
    US6911375B2|2003-06-02|2005-06-28|International Business Machines Corporation|Method of fabricating silicon devices on sapphire with wafer bonding at low temperature|
    DE10334576B4|2003-07-28|2007-04-05|Infineon Technologies Ag|Method for producing a semiconductor component with a plastic housing|
    JP4462997B2|2003-09-26|2010-05-12|株式会社ディスコ|Wafer processing method|
    JP4447280B2|2003-10-16|2010-04-07|リンテック株式会社|Surface protection sheet and semiconductor wafer grinding method|
    US7084201B2|2003-11-14|2006-08-01|Wall-Guard Corporation Of Ohio|Non-flammable waterproofing composition|
    KR20060126674A|2003-11-27|2006-12-08|제이에스알 가부시끼가이샤|Hot melt adhesive composition|
    JP2006135272A|2003-12-01|2006-05-25|Tokyo Ohka Kogyo Co Ltd|Substrate support plate and peeling method of support plate|
    US20050150597A1|2004-01-09|2005-07-14|Silicon Genesis Corporation|Apparatus and method for controlled cleaving|
    US7279063B2|2004-01-16|2007-10-09|Eastman Kodak Company|Method of making an OLED display device with enhanced optical and mechanical properties|
    RU2273075C2|2004-01-28|2006-03-27|Открытое акционерное общество "Научно-исследовательский институт полупроводникового машиностроения" |Semiconductor wafer treatment device|
    KR100696287B1|2004-01-28|2007-03-19|미쓰이 가가쿠 가부시키가이샤|Method of protecting semiconductor wafer|
    DE102004007060B3|2004-02-13|2005-07-07|Thallner, Erich, Dipl.-Ing.|Semiconductor wafer bonding device using application of adhesive before alignment and contacting of corresponding surfaces of semiconductor wafers|
    FR2866983B1|2004-03-01|2006-05-26|Soitec Silicon On Insulator|REALIZING AN ENTITY IN SEMICONDUCTOR MATERIAL ON SUBSTRATE|
    JP2005268690A|2004-03-22|2005-09-29|Sumitomo Bakelite Co Ltd|Manufacturing method of multi-layered circuit substrate|
    JP4539368B2|2005-02-24|2010-09-08|ソニー株式会社|Manufacturing method of display device|
    EP1854136A1|2005-03-01|2007-11-14|Dow Corning Corporation|Temporary wafer bonding method for semiconductor processing|
    JP4721828B2|2005-08-31|2011-07-13|東京応化工業株式会社|Support plate peeling method|
    US8268449B2|2006-02-06|2012-09-18|Brewer Science Inc.|Thermal- and chemical-resistant acid protection coating material and spin-on thermoplastic adhesive|
    JP4682883B2|2006-03-10|2011-05-11|株式会社豊田自動織機|Method for dividing bonded substrates|
    US20070267972A1|2006-05-22|2007-11-22|Menegus Harry E|Method for forming a temporary hermetic seal for an OLED display device|
    US20070274871A1|2006-05-23|2007-11-29|Genetix Limited|Well plate|
    CN101356047B|2006-07-06|2011-11-09|Rena有限责任公司|Apparatus and method for separating and transporting substrates|
    JP2008021929A|2006-07-14|2008-01-31|Tokyo Ohka Kogyo Co Ltd|Support plate, carrying device, and peeling device and peeling method|
    US7713835B2|2006-10-06|2010-05-11|Brewer Science Inc.|Thermally decomposable spin-on bonding compositions for temporary wafer bonding|
    US20080200011A1|2006-10-06|2008-08-21|Pillalamarri Sunil K|High-temperature, spin-on, bonding compositions for temporary wafer bonding using sliding approach|
    JP2008171934A|2007-01-10|2008-07-24|Lintec Corp|Protective structure of fragile member, and processing method for fragile member|
    KR101255867B1|2007-01-31|2013-04-17|신에츠 엔지니어링 가부시키가이샤|Adhesive chuck device|
    JP4729003B2|2007-06-08|2011-07-20|リンテック株式会社|Processing method for brittle members|
    US20100288431A1|2007-10-19|2010-11-18|Greet Bossaert|An adhesive tape|
    JP2009154407A|2007-12-27|2009-07-16|Tdk Corp|Peeling apparatus, peeling method, and information recording medium manufacturing method|
    JP5111620B2|2008-01-24|2013-01-09|ブルーワーサイエンスアイエヌシー．|Method of mounting device wafer reversely on carrier substrate|
    JP2010010207A|2008-06-24|2010-01-14|Tokyo Ohka Kogyo Co Ltd|Separating apparatus and separating method|
    US8852391B2|2010-06-21|2014-10-07|Brewer Science Inc.|Method and apparatus for removing a reversibly mounted device wafer from a carrier substrate|JP4746003B2|2007-05-07|2011-08-10|リンテック株式会社|Transfer device and transfer method|
    JP5111620B2|2008-01-24|2013-01-09|ブルーワーサイエンスアイエヌシー．|Method of mounting device wafer reversely on carrier substrate|
    US8092628B2|2008-10-31|2012-01-10|Brewer Science Inc.|Cyclic olefin compositions for temporary wafer bonding|
    US9601530B2|2008-12-02|2017-03-21|Arizona Board Of Regents, A Body Corporated Of The State Of Arizona, Acting For And On Behalf Of Arizona State University|Dual active layer semiconductor device and method of manufacturing the same|
    US9721825B2|2008-12-02|2017-08-01|Arizona Board Of Regents, A Body Corporate Of The State Of Arizona, Acting For And On Behalf Of Arizona State University|Method of providing a flexible semiconductor device and flexible semiconductor device thereof|
    US9991311B2|2008-12-02|2018-06-05|Arizona Board Of Regents On Behalf Of Arizona State University|Dual active layer semiconductor device and method of manufacturing the same|
    US8476165B2|2009-04-01|2013-07-02|Tokyo Electron Limited|Method for thinning a bonding wafer|
    US8366873B2|2010-04-15|2013-02-05|Suss Microtec Lithography, Gmbh|Debonding equipment and methods for debonding temporary bonded wafers|
    US9837295B2|2010-04-15|2017-12-05|Suss Microtec Lithography Gmbh|Apparatus and method for semiconductor wafer leveling, force balancing and contact sensing|
    US8950459B2|2009-04-16|2015-02-10|Suss Microtec Lithography Gmbh|Debonding temporarily bonded semiconductor wafers|
    US9859141B2|2010-04-15|2018-01-02|Suss Microtec Lithography Gmbh|Apparatus and method for aligning and centering wafers|
    JP5439583B2|2009-04-16|2014-03-12|ススマイクロテクリソグラフィー，ゲーエムベーハー|Improved apparatus for temporary wafer bonding and debonding|
    US9064686B2|2010-04-15|2015-06-23|Suss Microtec Lithography, Gmbh|Method and apparatus for temporary bonding of ultra thin wafers|
    US8551291B2|2010-04-15|2013-10-08|Suss Microtec Lithography, Gmbh|Debonding equipment and methods for debonding temporary bonded wafers|
    US9305769B2|2009-06-30|2016-04-05|Taiwan Semiconductor Manufacturing Company, Ltd.|Thin wafer handling method|
    US8871609B2|2009-06-30|2014-10-28|Taiwan Semiconductor Manufacturing Company, Ltd.|Thin wafer handling structure and method|
    EP2706562A3|2009-09-01|2014-09-03|EV Group GmbH|Device and method for releasing a semiconductor wafer from a carrier substrate by tilting a film frame|
    DE102009050568A1|2009-10-23|2011-04-28|Schott Ag|Cover disk for a signaling system in railway areas and street area and for display- and traffic light device in traffic and scoreboard, comprises a substrate on which a coating is applied and which is a soda-lime glass disk|
    KR101105918B1|2009-11-30|2012-01-17|주식회사 엘지실트론|Method of manufacturing nitride compound semiconductor device|
    TWI412096B|2009-12-15|2013-10-11|Hiwin Tech Corp|Wafer protection device and the operation process thereof|
    JP5535670B2|2010-01-28|2014-07-02|富士フイルム株式会社|Manufacturing method of radiation image detector|
    US9159595B2|2010-02-09|2015-10-13|Suss Microtec Lithography Gmbh|Thin wafer carrier|
    KR20120132624A|2010-02-12|2012-12-06|다우 코닝 코포레이션|Temporary wafer bonding method for semiconductor processing|
    US8541886B2|2010-03-09|2013-09-24|Stats Chippac Ltd.|Integrated circuit packaging system with via and method of manufacture thereof|
    EP2553719B1|2010-03-31|2019-12-04|Ev Group E. Thallner GmbH|Method for producing a wafer provided with chips using two separately detachable carrier wafers with ring-shaped adhesive layers of different ring widths|
    JP5728163B2|2010-04-02|2015-06-03|東京応化工業株式会社|Stripping method and stripping solution|
    US8932910B2|2010-05-20|2015-01-13|Ev Group E. Thallner Gmbh|Method for producing chip stacks, and a carrier for carrying out the method|
    US8742009B2|2010-06-04|2014-06-03|Shin-Etsu Chemical Co., Ltd.|Temporary adhesive composition, and method of producing thin wafer|
    JP5671265B2|2010-06-10|2015-02-18|東京応化工業株式会社|Substrate processing method|
    US8852391B2|2010-06-21|2014-10-07|Brewer Science Inc.|Method and apparatus for removing a reversibly mounted device wafer from a carrier substrate|
    CN102315311A|2010-07-06|2012-01-11|杜邦太阳能有限公司|Solar cell module device and banding coating method thereof|
    US9263314B2|2010-08-06|2016-02-16|Brewer Science Inc.|Multiple bonding layers for thin-wafer handling|
    KR101735571B1|2010-08-20|2017-05-16|삼성전자주식회사|Thermal dissipation material and light emitting diode package including a junction part made of the thermal dissipation material|
    JP5714859B2|2010-09-30|2015-05-07|芝浦メカトロニクス株式会社|Substrate laminate, bonding apparatus, peeling apparatus, and substrate manufacturing method|
    WO2012062343A1|2010-11-12|2012-05-18|Ev Group E. Thallner Gmbh|Measuring device and method for measuring layer thicknesses and defects in a wafer stack|
    US8415183B2|2010-11-22|2013-04-09|Tsmc Solid State Lighting Ltd.|Wafer level conformal coating for LED devices|
    US8753460B2|2011-01-28|2014-06-17|International Business Machines Corporation|Reduction of edge chipping during wafer handling|
    CN102637575B|2011-02-09|2015-07-01|群康科技有限公司|Manufacturing method of component baseplate|
    KR101579772B1|2011-02-18|2015-12-23|어플라이드 머티어리얼스, 인코포레이티드|Method and system for wafer level singulation|
    CN103460369B|2011-04-11|2016-12-28|Ev 集团 E·索尔纳有限责任公司|Flexible bearing support, for the device making bearing basement depart from and method|
    WO2012167814A1|2011-06-06|2012-12-13|Ev Group E. Thallner Gmbh|Method and device for determining the pressure distribution for bonding|
    WO2013006865A2|2011-07-07|2013-01-10|Brewer Science Inc.|Methods of transferring device wafers or layers between carrier substrates and other surfaces|
    RU2469433C1|2011-07-13|2012-12-10|Юрий Георгиевич Шретер|Method for laser separation of epitaxial film or layer of epitaxial film from growth substrate of epitaxial semiconductor structure |
    DE102011079687A1|2011-07-22|2013-01-24|Wacker Chemie Ag|Temporary bonding of chemically similar substrates|
    JP2013026546A|2011-07-25|2013-02-04|Dainippon Printing Co Ltd|Substrate for thin film device and method of manufacturing thin film device|
    US8940104B2|2011-08-02|2015-01-27|Brewer Science Inc.|Cleaning composition for temporary wafer bonding materials|
    US20130061869A1|2011-09-06|2013-03-14|Brewer Science Inc.|Use of megasonic energy to assist edge bond removal in a zonal temporary bonding process|
    SG2014009955A|2011-09-20|2014-08-28|Ev Group E Thallner Gmbh|Device and method for coating of a carrier wafer|
    JP5962395B2|2011-09-28|2016-08-03|Jsr株式会社|Method for temporarily fixing substrate, semiconductor device, and composition for temporary fixing|
    JP5913053B2|2011-12-08|2016-04-27|東京エレクトロン株式会社|Peeling apparatus, peeling system, peeling method, program, and computer storage medium|
    KR20200019772A|2011-12-22|2020-02-24|에베 그룹 에. 탈너 게엠베하|Flexible substrate holder, device and method for detaching a first substrate|
    US8696864B2|2012-01-26|2014-04-15|Promerus, Llc|Room temperature debonding composition, method and stack|
    US8975157B2|2012-02-08|2015-03-10|Advanced Semiconductor Engineering, Inc.|Carrier bonding and detaching processes for a semiconductor wafer|
    WO2013119976A1|2012-02-08|2013-08-15|Brewer Science Inc.|Fluorinated silane coating compositions for thin wafer bonding and handling|
    US10543662B2|2012-02-08|2020-01-28|Corning Incorporated|Device modified substrate article and methods for making|
    JP6055597B2|2012-02-09|2016-12-27|東京応化工業株式会社|Sticking method and sticking device|
    US8697542B2|2012-04-12|2014-04-15|The Research Foundation Of State University Of New York|Method for thin die-to-wafer bonding|
    JP5348341B1|2012-04-27|2013-11-20|Ｊｓｒ株式会社|Substrate processing method, temporary fixing composition, and semiconductor device|
    US9127126B2|2012-04-30|2015-09-08|Brewer Science Inc.|Development of high-viscosity bonding layer through in-situ polymer chain extension|
    JP5360260B2|2012-05-08|2013-12-04|Ｊｓｒ株式会社|SUBSTRATE PROCESSING METHOD, LAMINATE, AND SEMICONDUCTOR DEVICE|
    JP5901422B2|2012-05-15|2016-04-13|古河電気工業株式会社|Semiconductor wafer dicing method and semiconductor processing dicing tape used therefor|
    JP6063641B2|2012-05-16|2017-01-18|株式会社ディスコ|Wafer protection member|
    JP5752639B2|2012-05-28|2015-07-22|東京エレクトロン株式会社|Joining system, joining method, program, and computer storage medium|
    CN103035580B|2012-07-24|2015-06-03|上海华虹宏力半导体制造有限公司|Temporary bonding and dissociating process method applied to thin silicon slices|
    WO2014019598A1|2012-07-30|2014-02-06|Erich Thallner|Substrate assembly, method and apparatus for bonding substrates|
    US8963336B2|2012-08-03|2015-02-24|Samsung Electronics Co., Ltd.|Semiconductor packages, methods of manufacturing the same, and semiconductor package structures including the same|
    KR101970291B1|2012-08-03|2019-04-18|삼성전자주식회사|Methods of manufacturing semiconductor packages|
    KR101276487B1|2012-10-05|2013-06-18|주식회사 이녹스|Wafer laminated body and method for bonding and debonding between device wafer and carrier wafer|
    US9029238B2|2012-10-11|2015-05-12|International Business Machines Corporation|Advanced handler wafer bonding and debonding|
    US9269623B2|2012-10-25|2016-02-23|Rohm And Haas Electronic Materials Llc|Ephemeral bonding|
    US20140117509A1|2012-10-26|2014-05-01|Infineon Technologies Ag|Metal Deposition with Reduced Stress|
    DE102012220954A1|2012-11-16|2014-05-22|Wacker Chemie Ag|Sandable silicone elastomer composition and use thereof|
    US10014177B2|2012-12-13|2018-07-03|Corning Incorporated|Methods for processing electronic devices|
    TW201429708A|2012-12-13|2014-08-01|Corning Inc|Glass and methods of making glass articles|
    TWI594960B|2013-03-15|2017-08-11|康寧公司|Bulk annealing of glass sheets|
    TWI617437B|2012-12-13|2018-03-11|康寧公司|Facilitated processing for controlling bonding between sheet and carrier|
    US10086584B2|2012-12-13|2018-10-02|Corning Incorporated|Glass articles and methods for controlled bonding of glass sheets with carriers|
    US9340443B2|2012-12-13|2016-05-17|Corning Incorporated|Bulk annealing of glass sheets|
    EP2747130B1|2012-12-21|2017-10-11|ams AG|Method of producing a removable wafer connection and a wafer-carrier assembly|
    JP6170672B2|2012-12-27|2017-07-26|富士フイルム株式会社|Temporary adhesive for manufacturing semiconductor device, adhesive support using the same, and method for manufacturing semiconductor device|
    EP2752871B1|2013-01-08|2015-09-16|ams AG|Method of application of a carrier to a device wafer|
    JP6162976B2|2013-02-26|2017-07-12|東京応化工業株式会社|Substrate processing method|
    EP2772939B1|2013-03-01|2016-10-19|Ams Ag|Semiconductor device for detection of radiation and method of producing a semiconductor device for detection of radiation|
    US10000675B2|2013-03-03|2018-06-19|John Cleaon Moore|Temporary adhesive with tunable adhesion force sufficient for processing thin solid materials|
    US9028628B2|2013-03-14|2015-05-12|International Business Machines Corporation|Wafer-to-wafer oxide fusion bonding|
    CN104981889B|2013-03-14|2017-03-08|富士电机株式会社|The manufacture method of semiconductor device|
    US9093489B2|2013-03-15|2015-07-28|Taiwan Semiconductor Manufacturing Company, Ltd.|Selective curing method of adhesive on substrate|
    JP5921473B2|2013-03-21|2016-05-24|株式会社東芝|Manufacturing method of semiconductor device|
    JP6114596B2|2013-03-26|2017-04-12|富士フイルム株式会社|Laminate for temporary bonding for manufacturing semiconductor device and method for manufacturing semiconductor device|
    JP5975918B2|2013-03-27|2016-08-23|富士フイルム株式会社|Laminate for temporary bonding for manufacturing semiconductor device and method for manufacturing semiconductor device|
    JP6050170B2|2013-03-27|2016-12-21|富士フイルム株式会社|Laminate for temporary bonding for manufacturing semiconductor device and method for manufacturing semiconductor device|
    CN104103731A|2013-04-03|2014-10-15|新世纪光电股份有限公司|Light-emitting diode structure and manufacturing method thereof|
    CN103259069B|2013-04-12|2015-06-24|上海安费诺永亿通讯电子有限公司|Transmission line capable of reducing loss|
    CN103259070B|2013-04-12|2016-08-03|上海安费诺永亿通讯电子有限公司|The low-loss transmission line of a kind of fall|
    CN103280423A|2013-05-29|2013-09-04|华进半导体封装先导技术研发中心有限公司|Technology and system for mechanical bonding disassembling|
    US9058974B2|2013-06-03|2015-06-16|International Business Machines Corporation|Distorting donor wafer to corresponding distortion of host wafer|
    CN103441083B|2013-06-27|2016-03-30|清华大学|A kind of interim bonding method integrated for three-dimensional|
    US9508659B2|2013-07-01|2016-11-29|Taiwan Semiconductor Manufacturing Company, Ltd.|Method and apparatus to protect a wafer edge|
    KR20150011072A|2013-07-22|2015-01-30|삼성전자주식회사|Temporary bonding adhesive composition and method of manufacturing a semiconductor device using the same|
    CN103367221A|2013-07-23|2013-10-23|华进半导体封装先导技术研发中心有限公司|Wafer bonding removing and bonding technology and system|
    US8962449B1|2013-07-30|2015-02-24|Micron Technology, Inc.|Methods for processing semiconductor devices|
    KR101617316B1|2013-08-14|2016-05-02|코스텍시스템|A method for bonding / de-bonding of device wafer and carrier wafer and apparatus for bonding/de-bonding|
    US10103048B2|2013-08-28|2018-10-16|Brewer Science, Inc.|Dual-layer bonding material process for temporary bonding of microelectronic substrates to carrier substrates|
    JP6182491B2|2013-08-30|2017-08-16|富士フイルム株式会社|Laminate and its application|
    US10510576B2|2013-10-14|2019-12-17|Corning Incorporated|Carrier-bonding methods and articles for semiconductor and interposer processing|
    CN103633004B|2013-11-20|2016-05-25|中国电子科技集团公司第四十一研究所|The method of photoetching etched film circuitous pattern on the ultra-thin quartz substrate of 30 μ m-50 μ m|
    JP5607847B1|2013-11-29|2014-10-15|古河電気工業株式会社|Adhesive tape for semiconductor processing|
    US9224696B2|2013-12-03|2015-12-29|United Microelectronics Corporation|Integrated semiconductor device and method for fabricating the same|
    FR3015110B1|2013-12-17|2017-03-24|Commissariat Energie Atomique|METHOD FOR MANUFACTURING A HANDGRIP SUBSTRATE FOR TEMPORARY BONDING OF A SUBSTRATE|
    US9761474B2|2013-12-19|2017-09-12|Micron Technology, Inc.|Methods for processing semiconductor devices|
    JP6687523B2|2014-01-07|2020-04-22|ブルーワー サイエンス アイ エヌ シー．|Cyclic olefin polymer composition and polysiloxane release layer used for temporary adhesion treatment of wafer|
    US9865490B2|2014-01-07|2018-01-09|Brewer Science Inc.|Cyclic olefin polymer compositions and polysiloxane release layers for use in temporary wafer bonding processes|
    WO2015156891A2|2014-01-23|2015-10-15|Arizona Board Of Regents, Acting For And On Behalf Of Arizona State University|Method of providing a flexible semiconductor device and flexible semiconductor device thereof|
    US10381224B2|2014-01-23|2019-08-13|Arizona Board Of Regents On Behalf Of Arizona State University|Method of providing an electronic device and electronic device thereof|
    EP3099483A4|2014-01-27|2017-08-02|Corning Incorporated|Articles and methods for controlled bonding of thin sheets with carriers|
    EP2899760B1|2014-01-27|2018-08-29|ams AG|Semiconductor device for optical applications and method of producing such a semiconductor device|
    TW201530610A|2014-01-27|2015-08-01|Dow Corning|Temporary-bonded wafer systems and methods of making the same|
    CN103839862A|2014-02-28|2014-06-04|华进半导体封装先导技术研发中心有限公司|Mechanical bonding disassembling process method|
    KR101886939B1|2014-03-03|2018-08-08|후루카와 덴키 고교 가부시키가이샤|Adhesive tape for semiconductor processing|
    JP6151204B2|2014-03-04|2017-06-21|東京エレクトロン株式会社|Joining method and joining system|
    CN106457758B|2014-04-09|2018-11-16|康宁股份有限公司|The modified substrate article and preparation method thereof of device|
    CN103956327A|2014-04-28|2014-07-30|华进半导体封装先导技术研发中心有限公司|Laser bonding-removing technological method and system|
    EP3143641A4|2014-05-13|2018-01-17|Arizona Board of Regents, a Body Corporate of the State of Arizona acting for and on behalf of Arizona State University|Method of providing an electronic device and electronic device thereof|
    JP6344971B2|2014-05-16|2018-06-20|株式会社ディスコ|Support plate, support plate forming method and wafer processing method|
    SG11201700478YA|2014-07-22|2017-02-27|Brewer Science Inc|Polyimides as laser release materials for 3-d ic applications|
    CN105336682A|2014-08-06|2016-02-17|上海和辉光电有限公司|Fabrication method of flexible substrate, fixing method and fixing structure|
    US10978334B2|2014-09-02|2021-04-13|Applied Materials, Inc.|Sealing structure for workpiece to substrate bonding in a processing chamber|
    US10141216B2|2014-10-22|2018-11-27|Promerus, Llc|Room temperature debondable and thermally curable compositions|
    US9741742B2|2014-12-22|2017-08-22|Arizona Board Of Regents, A Body Corporate Of The State Of Arizona, Acting For And On Behalf Of Arizona State University|Deformable electronic device and methods of providing and using deformable electronic device|
    US10446582B2|2014-12-22|2019-10-15|Arizona Board Of Regents On Behalf Of Arizona State University|Method of providing an imaging system and imaging system thereof|
    JP6225894B2|2014-12-24|2017-11-08|信越化学工業株式会社|Wafer temporary bonding method and thin wafer manufacturing method|
    EP3245263A1|2015-01-14|2017-11-22|EV Group E. Thallner GmbH|Method and device for detaching a substrate from a substrate stack|
    DE102015100863B4|2015-01-21|2022-03-03|Infineon Technologies Ag|Method of handling a product substrate and a bonded substrate system|
    EP3253617A1|2015-02-06|2017-12-13|Adient Luxembourg Holding S.à r.l.|Method for connecting components of a vehicle seat and vehicle seat|
    JP2016146429A|2015-02-09|2016-08-12|トヨタ自動車株式会社|Semiconductor device manufacturing method|
    US9644118B2|2015-03-03|2017-05-09|Dow Global Technologies Llc|Method of releasably attaching a semiconductor substrate to a carrier|
    US10522383B2|2015-03-25|2019-12-31|International Business Machines Corporation|Thermoplastic temporary adhesive for silicon handler with infra-red laser wafer de-bonding|
    JP2018524201A|2015-05-19|2018-08-30|コーニング インコーポレイテッド|Articles and methods for bonding sheets with carriers|
    DE102015210384A1|2015-06-05|2016-12-08|Soitec|Method for mechanical separation for a double-layer transfer|
    CN104916550A|2015-06-09|2015-09-16|深圳市华星光电技术有限公司|Method for manufacturing flexible substrate and substrate structure|
    WO2017034645A2|2015-06-09|2017-03-02|ARIZONA BOARD OF REGENTS, a body corporate for THE STATE OF ARIZONA for and on behalf of ARIZONA STATE UNIVERSITY|Method of providing an electronic device and electronic device thereof|
    US9799625B2|2015-06-12|2017-10-24|Taiwan Semiconductor Manufacturing Company Ltd.|Semiconductor structure and manufacturing method thereof|
    CN105280541A|2015-09-16|2016-01-27|中国电子科技集团公司第五十五研究所|Temporary bonding method and bonding-removing method for ultrathin semiconductor wafer|
    RU2612879C1|2015-10-15|2017-03-13|Акционерное общество "Концерн радиостроения "Вега"|Method for temporary fixing substrates on technological basis|
    DE102015118742A1|2015-11-02|2017-05-04|Ev Group E. Thallner Gmbh|Method for bonding and releasing substrates|
    US10050012B2|2015-11-25|2018-08-14|International Business Machines Corporation|Method for semiconductor die removal rework|
    DE102016106351A1|2016-04-07|2017-10-12|Ev Group E. Thallner Gmbh|Method and device for bonding two substrates|
    TW201825623A|2016-08-30|2018-07-16|美商康寧公司|Siloxane plasma polymers for sheet bonding|
    US20180068843A1|2016-09-07|2018-03-08|Raytheon Company|Wafer stacking to form a multi-wafer-bonded structure|
    CN106847718A|2017-03-28|2017-06-13|深圳市化讯半导体材料有限公司|A kind of interim bonding of device wafers with tear bonding technology open|
    US10403598B2|2017-08-11|2019-09-03|Micron Technology, Inc.|Methods and system for processing semiconductor device structures|
    US10326044B2|2017-08-18|2019-06-18|Micron Technology, Inc.|Method and apparatus for processing semiconductor device structures|
    US10300649B2|2017-08-29|2019-05-28|Raytheon Company|Enhancing die flatness|
    KR20200050967A|2017-09-12|2020-05-12|에베 그룹 에. 탈너 게엠베하|Method and apparatus for separating temporarily bonded substrate stacks|
    KR20200092349A|2017-12-22|2020-08-03|브레우어 사이언스 인코포레이션|Laser-separable adhesive material for 3-D IC applications|
    US10446431B2|2017-12-27|2019-10-15|Micron Technology, Inc.|Temporary carrier debond initiation, and associated systems and methods|
    US10847569B2|2019-02-26|2020-11-24|Raytheon Company|Wafer level shim processing|
    法律状态:
    2019-03-15| MK07| Expiry|Effective date: 20190131 |
    优先权:
    申请号 | 申请日 | 专利标题
    US2337908P| true| 2008-01-24|2008-01-24|
    ATA9035/2009A|AT508318A3|2008-01-24|2009-01-23|PROCESS FOR TEMPORARILY INSTALLING A BUILDING UNIT ON A SUPPORTING SUBSTRATE|
    [返回顶部]